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Contents1 Introduction 1 1.

1 Introduction . . . . .

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. . .11.2 Need of Project . . .

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.21.3 Target Community of Project .

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.21.5 Objective of Project . . .

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.21.6 Gantt Chart . . . .

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. . .32 Literature Survey 4 2.1 Quectel M95 GSM modem . .

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. . .43 Design Methodology 7 3.1 System Requirements and Specications . .

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1 General Features . . . . . . . .

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.73.1.2 Specication of data .

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.83.1.3 USSD . . .

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93.1.4 Specications for SMS via GSM /GPRS . . .

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. .93.1.5 Specications for Voice . .

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. .93.1.6 Interfaces . . . .

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.103.2 Block diagram and description . . . . .

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. . .10 3.2.1 Transmitter .

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.103.2.2 Receiver . . . .

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. . . . . . . . . . . . . . . . . . . . .113.2.3 Block diagram Description . . . . . . . . . . . . . . . . . . . . . . . . . . .113.2.4 Working: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133.3 Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143.3.1 RF: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153.3.2 Audio: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153.3.3 SIM Card: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153.3.4 Power supply: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153.3.5 Power On: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153.3.6 UART Port: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153.3.7 Functional Diagram: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.3.8 Renesas microcontroller: . . . . . . . . . . . . . . . . . . . . . . . . . . . .173.3.9 Audio IC (P89170): . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .183.3.10 Quectel M95 GSM Modem: . . . . . . . . . . . . . . . . . . . . . . . . . .183.3.11 Power Supply Designing . . . . . . . . . . . . . . . . . . . . . . . . . . . .203.3.12 LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .313.4 Software Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31 3.4.1 Modern tools used . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .313.4.2 Algorithms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .393.4.3 Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .403.5 PCB Design and Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .433.5.1 Introduction to PCB: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .443.5.2 Manufacturing process of printed circuit board . . . . . . . . . . . . . . . .443.6 Noise immunity of system and environment related aspects . . . . . . . . . . . . . .504 TEST PROCEDURE AND RESULTS 52 4.1 Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .524.1.1 Bread board testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .524.1.2 Trouble Shooting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .524.2 Simulation Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .525 CONCLUSION AND FUTURE SCOPE 55 5.1 Advantages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .555.2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .555.3 Conclusion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .555.4 Future scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56List of Figures1.1 Gantt Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32.1 SIM 900 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43.1 Tranmitter Side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103.2 Receiver Side . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .113.3 DTMF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .133.4 Hardware Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143.5 SIM cards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.6 Functional Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .173.7 Renesas Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .173.8 Design of Network and Status LED . . . . . . . . . . . . . . . . . . . . . . . . . .183.9 GSM module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .193.10 Block diagram of power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . .203.11 circuit diagram of power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . .203.12 step-down transformer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .213.13 full wave bridge rectier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .233.14 positive half cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .243.15 output waveform of full wave bridge rectier . . . . . . . . . . . . . . . . . . . . .253.16 electrolytic capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .263.17 aluminum electrolytic capacitor indicating positive and negative terminals . . . . . .273.18 pinout diagram of LM7812 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .283.19 relay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .293.20 Schematic of Relay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .303.21 Actual view of Relay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .303.22 LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .313.23 Screenshot of Altium software . . . . . . . . . . . . . . . . . . . . . . . . . . . . .323.24 Screenshot of OrCAD software . . . . . . . . . . . . . . . . . . . . . . . . . . . . .333.25 Screenshot of VB software . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .333.26 Screenshot of Commchk . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .383.27 Gold wave software used for voice recording . . . . . . . . . . . . . . . . . . . . .393.28 Main Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .413.29 User Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .413.30 parameter Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .423.31 Main Form . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .423.32 Process ow for PCB Designing . . . . . . . . . . . . . . . . . . . . . . . . . . . .433.33 Manufacturing Process of Printed Circuit Board . . . . . . . . . . . . . . . . . . . .443.34 Screen printing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .453.35 Bottom layer of power supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . .463.36 Relay Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .473.37 Bottom layer of main circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .483.38 PCB Layout of main circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .493.39 Typical EMI/RFI Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .503.40 Typical Noise Paths . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .504.1 power supply simulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .534.2 3.3V power supply simulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .534.3 Simulation of LED interfacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . .544.4 Output at the receiver end . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54List of Tables2.1 Comparison between GSM modem . . . . . . . . . . . . . . . . . . . . . . . . . . .53.1 General features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83.2 Specication of Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .83.3 USSD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93.4 Specications for SMS via GSM /GPRS . . . . . . . . . . . . . . . . . . . . . . . .93.5 Specications for Voice . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93.6 Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .103.7 Keypad commands description . . . . . . . . . . . . . . . . . . . . . . . . . . . . .143.8 RF Receiving Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153.9 Turns per volt of transformer for 50Hz frequency . . . . . . . . . . . . . . . . . . .223.10 Pin Details of 7812 IC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .283.11 GSM Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .373.12 IVRS Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40Chapter 1Introduction1.1 IntroductionThis Project is a very good example of embedded system as all its operations are controlled by in-telligent software inside the micro-controller. The aim of this project is to control i.e. to ON/OFFcontrol of different motors, the electrical or electronic appliances connected to this system from any-where in the world. For this purpose user can use any type of Mobile. This way it overcomes thelimited range of infrared and radio remote controls. Using the convenience of SMS and Phone calls,this project lets you remotely control equipment by s ending text messages and all of which can bepreprogrammed into the controller and easily remembered later.Short Message Service (SMS) is de-ned as a text-based service. That enables up to 160 characters to be sent from one mobile phone toanother. In fact, SMS has taken on a life of its own; spawning a whole new shorthand language thatsrapidly many industries have been quick to make use of this technology, with millions of handsetscurrently in use. Seeing the illiteracy in India we overcome the problem of reading and writing textmessages by providing the facility of voice calls with the help of IVR system which would be morehelpful and benecial to rural and uneducated farmers. With this in mind, weve designed the projectto work with Quectel M95 GSM modem. Some wise individual once aforementioned that systemcould be a system wherever we will nish off the machine whenever we’d like. Thats the distinctionbetween controlled and uncontrolled system. Our project is regarding create this system economicaland dynamic. Because the name instructed the automated management is for dominant the motorfrom remote place,look over its operational conditions; get feedback from the motor itself. Our targetis to manage the motor from distant place by mobile DTMF tone and conjointly get feedback bySMS whereas it’s in ON or OFF condition. We tend to conjointly make sure the safe operation of themotor by police investigation the voltage of the supply and guarantee feedback from system whereasit’s over or below voltage. Once more we tend to conjointly get these feedback by SMS additionally.GSM network is all over in our country thats why we decide GSM network to control our motorconjointly transferring feedback data through it. We tend to jointly use GSM network as a result ofif we tend to use it then we tend to dont have to be compelled to establish further instrumentationfor networking. To transmit feedback signals we tend to use GSM electronic equipment at the motornish jointly generate management signal by mobile DTMF as a result of it’s terribly simple to getDTMF by mobile station and send feedback SMS by electronic equipment additionally. In industrialsector we tend to hope our project is become handy and value effective to control motor and providesits protection.11.2 Need of ProjectMany industries have been quick to make use of GSM based technology, with millions of handsetscurrently in use. As new models with “must have” features hit the market, older models becomevirtually worthless and if not recycled, end up in landll. With this in mind, we have designed theQuectel M95 GSM modem.Since it has very Good range an accuracy as compared with SIM 300 andSIM 900.1.3 Target Community of Project In Industrial starter motor In agricultural elds VTS Industry PDA Personal Tracking Wireless POS Smart Metering1.4 Scope of ProjectProblems caused due to the existed systems are doesnt provide any power status, motor on/off status.Some of the systems are purely SMS based systems. But many of farmers didnt know about SMS. Soour intension behind is minimizing the work of farmers, improving the use of irrigation, maintainingoptimal usage of electricity to provide an interactive system to farmers .The main aim of this projectis to provide exibility to trigger the motor pumps from any location in an easy way.1.5 Objective of ProjectThe main objective for designing the project is that to develop user friendly testing software. Thatsbenets minimum time required for testing Quectel M95 GSM modem.Quectel M95 GSM modemuse in industrial starter motor which is our company requirement. Quectel M95 GSM Modem becauseprevious GSM series SIM 300 & SIM 900 having lot of problem rst common problems found inthat series. Modem initialization time is very high in SIM300 and SIM 900. It takes approximately5 to 10 minutes for initialization where Quectel M95 GSM Modem it takes only 1 minutes time forinitialization.21.6 Gantt ChartFigure 1.1:Gantt Chart3Chapter 2Literature SurveyHistory GSM is a global system for mobile communication GSM is an international digital cellulartelecommunication. The GSM standard was released by ETSI (European Standard Telecommuni-cation Standard) back in 1989. The rst commercial services were launched in 1991 and after itsearly introduction in Europe; the standard went global in 1992. Since then, GSM has become themost widely adopted and fastest-growing digital cellular standard, and it is positioned to becomethe worlds dominant cellular standard. Todays second-generation GSM networks deliver high qual-ity and secure mobile voice and data services (such as SMS/ Text Messaging) with full roamingcapabilities across the world. The Global System for Mobile Communication (GSM) network isa cellular telecommunication network with a versatile architecture complying with the ETSI GSM900/GSM 1800 standard. Siemens implementation is the digital cellular mobile communication sys-tem D900/1800/1900 that uses the very latest technology to meet every requirement of the standard.Now a days most likely used GSM modems are SIM 300 and SIM 900 that are triband and quad bandGSM modem respectively. Comparing with newer version of GSM modem i.e. Quectel M95 GSMmodem is compact in size, Ultra low power consumption and extended temperature range. Figure 2.1:SIM 900The detailed comparison between GSM modems is shown in below table2.1 Quectel M95 GSM modemM95 is one of the smallest Quad-band GSM/GPRS modules in LCC castellation packaging withthe compact size of 19.9 23.6 2.65mm, Ultra low power consumption and extended temperaturerange. With surface mounted technology, the low prole and small size of LCC package makesM95 easily embedded into the low-volume applications and ensures the reliable connectivity withthe applications. This kind of package is ideally suited for large-scale manufacturing which has the4Product Features SIM 300 SIM 900 M95Power Consump-tion High Power Con-sumption Medium PowerConsumption Less Power Con-sumption Audio Interface Single Channel Single Channel Multi ChannelGPRS GPRS MobileStation Class B GPRS Class10 Max.85.6kbps(downlink) Class 1-12 con-gurable max85.6kbps (uplinkand downlink) Size 40+/- 0.15*33+/-0.15*3.3+/-0.3mm 24*24*3mm 19.9*23.6*2.65mmWeight 8g 3.4g 3gTable 2.1:Comparison between GSM modemstrict requirements for cost and efciency. Built-in unique QuecFOTATM technology allows M95 toupdate the rmware remotely. Additional features such as integrated TCP/IP protocol stack, serialmultiplexer and enhanced AT commands guarantee fast and reliable transmission of data, voice, SMSvia GSM/GPRS network and extend the functionality of the application without adding cost.Its tinysize and Ultra low power consumption makes M95 a very cost effective and feature-rich platformthat is quite suitable for a wide range of M2M applications such as VTS, Industry PDA, PersonalTracking, Wireless POS, Smart Metering and many other M2M applications. Enck, W., Ongtang,M., McDaniel, P. 1, A Study of Android Application Security Android is an OS designed for smart-phones. Depicted in Figure 1, Android provides a sandboxed application execution environment. Acustomized embedded Linux system interacts with the phone hardware and an off-processor cellularradio. The Binder middleware and application API runs on top of Linux. To simplify, an applica-tions only interface to the phone is through these APIs. All application is executed within a DalvikVirtual Machine (DVM) running under a unique UNIX uid. The phone comes pre-installed with aselection of system applications, e.g., phone dialer, address book. Applications interact with eachother and the phone through different forms of IPC. Intents are typed interprocess messages that aredirected to particular applications or systems services, or newscast to applications subscribing to aparticular intent type. Persistent content provider data stores are queried through SQL-like interfaces.Background services provide RPC and callback interfaces that applications use to trigger actions oraccess data. Finally user interface activities receive named action signals from the system and otherapplications. Binder acts as a mediation point for all IPC. Access to system resources (e.g., GPSreceivers, text messaging, phone services, and the Internet), data (e.g., address books, email) and IPCis governed by permissions assigned at install time. The permissions requested by the application andthe permissions required to access the applications interfaces/data are dened in its manifest le. Tosimplify, an application is allowed to access a resource or interface if the required permission allowsit. Permission assignmentand indirectly the security policy for the phoneare largely delegated to thephones owner: the user is presented a screen listing the permissions an application requests at installtime, which they can accept or reject. Skurski and Swiercz 2 propose a control system based on VNC for Symbian OS smartphones.This system was designed to improve application testing systems in mobile devices due to the lackof resources in mobile devices and the high cost of test environments. Also the solution proposedcould be used to perform remote conguration. As part of the Android platform exists the AndroidDebug Bridge (ADB) protocol 3 to provide debug functionality on devices. The platform integratesthis protocol and it offers a service of server when is congured on the device. Other aspect tobe considered is the remote visualization mechanisms that are useful for achieve a remote displayof the devices. The most popular system designed to perform remote control of devices is Virtual5Networking Computing 4. There are a large number of implementations to this solution includingapplied to Android software stack. It has an open protocol and it is widely deployed in the open sourcecommunity. This solution adapts very well to provide part of the functionality of the architecture,and it will be studied further.This paper focuses on the control of Android platforms. This is an openplatform that allows using other technologies (also open). In addition, Android platform allow thedevelopment of new ideas easily and test them with a set of open standards . The prototype generatedas implementation of the proposed architecture will be provided also as free software. According todata released by Nielsen 5, half of the consumers who recently purchased a smartphone chose anAndroid smartphone.6Chapter 3Design Methodology3.1 System Requirements and SpecicationsKey BenetOne of the smallest Quad-band GSM/ GPRS modules Easier soldering process with LCC package Embedded Class-AB amplier Power consumption as low as 1.3mA Embedded powerful Internet service protocols, multiple Sockets and IP addresses eCall / ERA-GLONASS (Supported in specic rmware) QuecFOTATM Jamming detection DTMF decoding3.1.1 General Features7Sr. No. Features Parameter Value1 Quad-band 850/ 900/ 1800/1900 MHz 2 GPRS Multi-slotClass 12, 1 12 cong-urable 3 GPRS MobileStation Class B4 Compliant toGSM Phase 2/2+ Class 4(2W @ 850/900 MHz)Class 1(1W @1800/1900MHz) 5 Supply VoltageRange 3.3 4.6V 4.0Vnominal 6 Low Power Con-sumption 1.3mA @DRX=5 1.2mA@ DRX=9 7 Operation Tem-perature -40 C to +85 C8 Dimensions 19.9 x 23.6 x2.65mm 9 Weight Approx. 3.0g10 Control via ATcommands GSM 07.07,07.05 and otherenhanced ATCommands Table 3.1:General features3.1.2 Specication of data 1 GPRS Class 12 Max. 85.6 kbps(uplink anddownlink) 2 PBCCH Support3 Coding Schemes CS 1, 2, 3, 44 CSD Up to 14.4 kbpsTable 3.2:Specication of Data83.1.3 USSD1 Non TransparentMode Yes2 Protocols PPP/ TCP/ UDP/HTTP/ FTP/SMTP/ MUX Table 3.3:USSD3.1.4 Specications for SMS via GSM /GPRS 1 Point-to-pointMO and MT 2 SMS Cell Broad-cast 3 Text and PDUMode Table 3.4:Specications for SMS via GSM /GPRS3.1.5 Specications for Voice 1 Speech CodecModes Half Rate (HR)Full Rate (FR)Enhanced FullRate (EFR)Adaptive Multi-Rate (AMR) 2 Echo Arithmetic Echo Cancel-lation EchoSuppressionNoise Reduction Table 3.5:Specications for Voice93.1.6 Interfaces1 SIM/ USIM 3V/ 1.8V2 UART 2 Interfaces3 Analog AudioChanel 2 EmbeddedClass-AB am-plier in onechannel 4 RTC Backup Yes5 Antenna Pad YesTable 3.6:Interfaces3.2 Block diagram and description3.2.1 Transmitter Figure 3.1:Tranmitter Side103.2.2 ReceiverFigure 3.2:Receiver Side3.2.3 Block diagram Description Renesas Micro controller:The RENESAS MCU is True Low Power Platform (as low as 66 a/mhz, and 0.57 a for RTC + LVD),Supply voltage is 1.6 V to 5.5 V operations, 16 to 512 Kbyte Flash, 41 DMIPS at 32 MHz, for GeneralPurpose Applications.LED indication: Power ON/OFF: When external power supply to controller green led will glow and it is showpower is given to unit. OL (RED): Over Load Fault. When current is owing from circuit beyond settable range thisled will glow. SMS/CALL (RED): Communication Indication When user call or sending SMS to unit this ledwill automatically ON NETWORK (RED): Network Indication when SIM card detect and mobile tower range is therethis led will glow.Max232 IC:Max232 IC is in SMD Package so it is very small in size due to that it requires less space. The11Max232 is used to transmit the Pc data to the Microcontroller and also from controller to Pc. It isalso used to shift the voltage level low to high a vise a versa. The MAX232 is a dual driver/receiverthat includes a capacitive voltage generator to supply TIA/EIA-232-F voltage levels from a single5-V supply. Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels.Current Transformer (CT):This Device is mainly used to monitor the Current .The CT is used to set the Starting Current of theMotor. A current transformer is an instrument transformer, used along with measuring or protectivedevices, in which the secondary current is proportional to the primary current and it differs from itby an angle i.e. approximately zero. Current transformer supply the protective relays with current ofmagnitude proportional to those of power circuit but sufciently reduce in magnitude. Input currentfor CT is 5A and output is 5mAGSM Modem:The GSM modem of Quectel M95used since it Has very Good Range an Accuracy As comparedWith SIM 300 and SIM 900. M95 is a Quad-band GSM/GPRS engine that works at frequencies ofGSM850MHz, GSM900MHz, DCS1800MHz and PCS1900MHz. The M95 features GPRS multi-slot class 12 and supports the GPRS coding schemes CS-1, CS-2, CS-3 and CS-4. With a tiny proleof 19.9mm 23.6mm 2.65mm, the module can meet almost all the requirements for M2M applica-tions, including Vehicles and Personal Tracking, Security System, Wireless POS, Industrial PDA,Smart Metering, and Remote Maintenance and Control, etc. M95 is an SMD type module with LCCpackage, which can be easily embedded into applications. It provides abundant hardware interfaceslike Audio and UART Interface. Designed with power saving technique, the current consumption ofM95 is as low as 1.3 mA in SLEEP mode when DRX is 5. M95 is integrated with Internet serviceprotocols, such as TCP/UDP, FTP and PPP. Extended AT commands have been developed for you touse these Internet service protocols easily.Power Supply :When we give single phase supply to GSM base controller for external power green led will glow andit is show power is given to unit.The primary function of power supply is to convert electric currentfrom a source to the correct voltage and frequency to power the load. Other function that powersupplies may perform include limiting the current drawn by the load to safe levels.We required 3.3V power suopply for Renesas microcontroller, 4V for audio IC (P89170), and 12Vpower supply for relay.When we give single phase supply to GSM base controller for external power green led will glowand it is show power is given to unit.Relay:Relay is an electrically operated switch. Relays are used where it is necessary to control a circuit bya separate low power signal, or where several circuits must be controlled by a one signal.Here we have used the relay to Switch the Motor On an off we have used Leone Company relaywhich operates on 6V DC its Function is SPDT that is single pole Double Throw and it has magneticcoil in it.Quectel M95 GSM modem:M95 is a Quad-band GSM/GPRS engine that works at frequencies of GSM850MHz, GSM900MHz,DCS1800MHz and PCS1900MHz. The M95 features GPRS multi-slot class 12 and supports theGPRS coding schemes CS-1, CS-2, CS-3 and CS-4.With a tiny prole of 19.9mm 23.6mm 2.65mm, the module can meet almost all the requirementsfor M2M applications, including Vehicles and Personal Tracking, Security System, Wireless POS,Industrial PDA, Smart Metering, and Remote Maintenance and Control, etc.12M95 is an SMD type module with LCC package, which can be easily embedded into applications. Itprovides abundant hardware interfaces like Audio and UART Interface.Designed with power saving technique, the current consumption of M95 is as low as 1.3 mA inSLEEP mode when DRX is 5.M95 is integrated with Internet service protocols, such as TCP/UDP, FTP and PPP. Extended ATcommands have been developed for you to use these Internet service protocols easily.DTMF Figure 3.3:DTMF3.2.4 Working:The MICROSTART GSM CONTROLLER has inbuilt Interactive Voice Response System (IVRS)controlled, start/stop and remote monitoring. User can control the motor by voice call and SMS onlyby entering the password, so it provides security to the user.The unit can be installed at all placeswhere controlling is needed for three-phase motor. It will monitor and measure all three phase volt-ages. The controller displays the fault occurred in the system through LEDs and accordingly send theSMS to the registered numbers, so that the user will be aware of the current status of the motor. Alsothe system will be providing the information in the regional language so that any ordinary person canhandle that system. The signal conditioning block is use to make voltage within the positive rangewhich can be read by the ADC which is in microcontroller.The SPDT relay is used as a switch, toON/OFF the motor.The microcontroller continuously monitor the RYB phase and if voltage is under, over voltage or notwithin the range then it will OFF the motor and send the corresponding message to user through GSMmodem.LEDs are used for corresponding indication like dry run, SPP, power on, etc. IC aP89170 isused for sound recording(clip).131 Press 1 MOTOR ON For Switch ONthe Site Motor 2 Press 3 MOTOR OFF For Switch OFFthe Site Motor 3 Press 4 SET CURRENT For Storing theMotor Current inMemory of GSMController 4 Press AUTO MODE For Auto ModeSelection UnitButton Shouldbe on AUTOPosition 5 Press 6 RESET FAULT For Clear theFaults Occurred 6 Press 7 CHANGE PASS-WORD For changing ex-iting password 7 Press 8 MANUALMODE For ManualMode SelectionUnit Buttoncan be on anyPosition 8 Press 9 STATUS For Current Sta-tus Off Motor andStarter Table 3.7:Keypad commands description3.3 Hardware design Figure 3.4:Hardware Architecture143.3.1 RF:M95 provides an RF antenna pad for antenna connection.M95 comes with grounding pads which arenext to the antenna pad in order to give a better grounding. To minimize the loss on the RF trace andRF cable, take design into account carefully. It is recommended that the insertion loss should meetthe following requirements: GSM850/EGSM900 is less than 1dB. DCS1800/PCS1900 is less than1.5dB. 1 GSM850 less than -109dbm 2 EGSM900 less than-109dbm3 DCS1800 less than -109dbm Table 3.8:RF Receiving Sensitivity3.3.2 Audio:Working voltage parameter of audio characteristic ranges from 1.2 to 2.0 and its unit is V. Similarly,Current parameter ranges from 1.2 to 2.0 and its unit is uA.3.3.3 SIM Card:The SIM interfaces supports the functionality of the GSM Phase 1 specication and also supports thefunctionality of the new GSM Phase 2+ specication for FAST 64 kbps SIM card, which is intendedfor use with a SIM application Tool-kit.3.3.4 Power supply:The power supply is one of the key issues in designing GSM terminals. Because of the 577us radioburst in GSM every 4.615ms; power supply must be able to deliver high current peaks in a burstperiod. During these peaks, drops on the supply voltage must not exceed minimum working voltageof module. For the M95 module, the max current consumption could reach to 1.6A during a transmitburst. It will cause a large voltage drop on the VBAT. In order to ensure stable operation of the mod-ule, it is recommended that the max voltage drop during the transmit burst does not exceed 400mV.3.3.5 Power On:The module can be turned on by driving the pin PWRKEY to a low level voltage, and after STATUSpin outputs a high level, PWRKEY pin can be released. After the STATUS pin goes to high level,PWRKEY can be released.3.3.6 UART Port: There are seven lines on UART interface. Contain data lines TXD and RXD, hardware ow control lines RTS and CTS, other controllines DTR, DCD and RI.15Figure 3.5:SIM cards Used for AT command, GPRS data, etc. Multiplexing function is supported on the UART Port. So far only the basic mode of multi-plexing is available. Support the communication baud rates as the following:300, 600, 1200, 2400, 4800, 9600,14400, 19200, 28800, 38400, 57600 and 115200. Support the following baud rates for Auto bauding function: 4800, 9600, 19200, 38400, 57600 and 1152003.3.7 Functional Diagram:The following gure shows a block diagram of M95 and illustrates the major functional parts.Radio frequency part Power management The Peripheral interface Power supply Turn-on/off interface UART interfaces Audio interfaces SIM interfaces RF interface RTC interface16Figure 3.6:Functional Diagram Figure 3.7:Renesas Microcontroller3.3.8 Renesas microcontroller: The expanding family of Renesas RL78 microcontrollers consists of both general-purpose andapplication-specic devices. These increasingly popular MCUs make possible ultralow-power appli-cations by giving system designers advanced power-saving features and high-performance operation. Because the devices offer important capabilities such as an innovative Snooze mode that allowsserial communication and ADC operation while the CPU is inactive, RL78 MCUs are demonstrablysuperior solutions for a vast span of battery-powered applications. Analog Integrations 10-bit ADC up to 17 channels with 2.125 s conversion time 8-bit DAC upto two channels Comparators (2 ch) with high-speed 70 ns (typ.) response time A comparator withtwo multiplexer inputs for four external inputs each PGA with max x32 gain and internal connectionto comparator and ADC inputsExtended Features DTC, ELC and MAC for highly efcient signal processing Timer RD for17motor applications IrDA support RL78 common platform with 32-64 KB ash and 24-64 pins Mi-gration path from R8C takes advantage of thecommon peripherals3.3.9 Audio IC (P89170):A P89170 series high performance Voice OTP is fabricated with Standard CMOS process with em-bedded 4M bits EPROM. It can store up to 170 sec voice message with 4-bit ADPCM compression at6KHz sampling rate.8-bit PCM is also available as user selectable option.Three trigger modes,simpleKey trigger mode,Parallel CPU trigger mode and CPU serial commandmode, facilitate different userinterface. User selectable triggering and output signal options provide maximum exibility to vari-ous applications.Built-in resistor controlled oscillator,8-bit current mode D/A output and PWM directspeaker driving output minimize the number of external components. PC controlled programmer anddeveloping software are available.3.3.10 Quectel M95 GSM Modem:Design of Network and Status LED: Apply Ohms law,Current for LED=1mAInput voltage =4VRLED=4/(1mA)=4KohmStandard value of RLED=4.7KohmTransistor BC847 is used to protect LED from overvoltage and overcurrent. Figure 3.8:Design of Network and Status LEDDevelopment Board consists of M12/M10 Quectel modem, Sim card slot, Regulator for Powersupply for modem, RS232 Port for Serial Communication, External Antenna connector, RJ11 con-nector for Voice Output.18Figure 3.9:GSM moduleFig.3.9 GSM ModuleThis is Quectel M95 GSM module mounted on a PCB with SIM Tray and other necessary con-nections. Very useful for rapid prototyping of newer designs and circuits involving GSM Module.Quectel Modules are very popular in the market.Its tiny size and ultra-low power consumption makesM95 a very cost effective and feature-rich platform that is quite suitable for a wide range of M2M ap-plications such as VTS, Industry PDA, Personal Tracking, Wireless POS, Smart Metering and manyother M2M applications.Hardware Specications Quectel M95 Quad Band GSM Module Voltage Supply- 3.7VDC to 4.2VDC GSM- Speaker, Mic, TTL Rx and TTL Tx Outputs Provision for GSM Antenna/Wired AntennaApplicationsGPRS Connectivity for serial/legacy devices such as Energy Meters, SCADA Systems, PLC,Machine Automation devices, RFID etc. Accurate timing for clocks and other systems from GPRS GSM/GPRS based reporting systemsAdvantages This device is developed by us and fabricated in India GSM Module with valid IMEI imported legally Tested for reliability and ruggedness193.3.11 Power Supply DesigningFigure 3.10:Block diagram of power supply Figure 3.11:circuit diagram of power supplyDescription The electrical power is almost exclusively generated, transmitted and distributed inthe form of ac because of economical consideration but for operation of most of the electronic de-vices and circuits, dc supply is required. Dry cells and batteries can be used for this purpose. Nodoubt, they have the advantages of being portable and ripple free but their voltages are low, they needfrequent replacement and are expensive in comparison to conventional dc power supplies.20Now days, almost all electronic equipment includes a circuit that converts ac supply into dc supply.The part of equipment that converts ac into dc is called DC power supply. In general at the inputof the power supply there is a power transformer. It is followed by a rectier (a diode circuit) 1asmoothing lter and then by a voltage regulator circuit.From the block diagram, the basic power supply is constituted by four elements,i. Transformerii. Rectieriii. Filteriv. RegulatorThe output of the dc power supply is used to provide a constant dc voltage across the load. Let usbriey outline the function of each of the elements of the dc power supply. Transformer is used tostep-up or step-down (usually to step-down) the-supply voltage as per need of the solid-state elec-tronic devices and circuits to be supplied by the dc power supply. It can provide isolation from thesupply line-an important safety consideration. It may also include internal shielding to prevent un-wanted electrical noise signal on the power line from getting into the power supply and possiblydisturbing the load. It is used to supply the power to ADC and microcontroller, LCD, etc.Design of power supplyi. TransformerStep-down transformer is one whose secondary voltage is less than its primary voltage. It is designedto reduce the voltage from the primary winding to the secondary winding. This kind of transformersteps down the voltage applied to it. As a step-down unit, the transformer converts high-voltage, low-current power into low-voltage, high-current power. The larger-gauge wire used in the secondarywinding is necessary due to the increase in current. The primary winding, which doesnt have to con-duct as much current, may be made of smaller-gauge wire. Figure 3.12:step-down transformerDesign of step down transformer:The following information must be available to the designer of the transformer. 1) Power output.2) Operating voltage. 3) Frequency range. 4) Efciency and regulation. Size of core is one of therst consideration in regard of weight and volume of a transformer. This depends on type of core andwinding conguration used. Generally following formula is used to nd Area or Size of the Core. Ai= Wp / 0.8721Where Ai = Area of cross section in square cm.Wp = Primary Wattage.For our project we require +5V output, so transformer secondary winding rating is 9V, 500mA.So secondary power wattage is,P2 = 9 * 500mA= 4.5WattSo,Ai = 4.5 / 0.87= 2.4Generally 10 So,Ai = 2.8a) Turns per volt: – Turns per volt of transformer are given by relation. Turns per volt = 100000 / 4.44f * Bm * AiWhere,F = Frequency in Hz.Bm = Density in Wb / Square meter.Ai = Net area of the cross section.Following table gives the value of turns per volt for 50 Hz frequency. 1 Flux density 0.76Wb /sq m 1.14 1.01 0.91 0.832 Turns per Volt 45/ Ai 40 /Ai 45 /Ai 50 /Ai 55 /Ai Table 3.9:Turns per volt of transformer for 50Hz frequencyGenerally lower the ux density better the quality of transformer. For our project we have takenthe turns per volt is 0.91 Wb / sq.m from above table.Turns per volt = 50 / Ai= 50 / 2.8= 17.85Thus the turns for the primary winding is,220 * 17.85 = 3927And for secondary winding,9 * 17.85 = 160Wire size: – As stated above the size is depends upon the current to be carried out by windingwhich depends upon current density. For our transformer one tie can safely use current density of 3.1Amp / sq.mm.For less copper loss 1.6Amp/sq.mm or 2.4sq.mm may be used generally even size gauge of wire areused.R.M.S secondary voltage at secondary to transformer is 9V. so maximum voltage Vm across sec-ondary is= 9 * 1.141= 12.727vThus we have used transformer of 25:1 turns ratio.ii. RectierD.C output voltage Vm across secondary is,22Vdc = 2 * Vm/pi= 2 * 12.727/3.14= 8.08 VP.I.V rating of each diode isPIV = 2Vdc= 2 * 8.08= 16.16 VMaximum forward current, which ow from each diode, is 500 mA. So from above parameter, weselect diode IN4007 from the diode selection manual.Rectier is a device which converts the sinusoidal ac voltage into either positive or negative pulsatingdc. P-N junction diode, which conducts when forward biased and practically does not conduct whenreverse biased, can be used for rectication i.e. for conversion of ac into dc. The rectier typicallyneeds one, two or four diodes.Rectiers may be either half-wave rectiers or full-wave rectiers (centre-tap or bridge) type. Theoutput voltage from a rectier circuit has a pulsating character i.e., it contains unwanted ac com-ponents (components of supply frequency f and its harmonics) along with dc component. For mostsupply purposes, constant direct voltage is required than that furnished by a rectier. To reduce accomponents from the rectier output voltage a lter circuit is required.Thus lter is a device which passes dc component to the load and blocks I ac components of the rec-tier output. Filter is typically constructed from reactive circuit I elements such as capacitors and/orinductors and resistors. The magnitude of output dc voltage may vary with the variation of either theinput ac voltage or the magnitude of load current. So at the output of a rectier lter combination avoltage regulator is required, to provide an almost constant dc voltage at the output of the regulator.The voltage regulator may be constructed from a Zener diode, and or discrete transistors, and/or in-tegrated circuits (ICs). Its main function is to maintain a constant dc output voltage.However, it also rejects any ac ripple voltage that is not removed by the lter. The regulator mayalso include protective devices such as short-circuit protection, current limiting, thermal shutdown,or over-voltage protection. Figure 3.13:full wave bridge rectierThis type of single phase rectier uses four individual rectifying diodes connected in a closedloop bridge conguration to produce the desired output.The main advantage of this bridge circuit is that it does not require a special centre tapped trans-former, thereby reducing its size and cost. The single secondary winding is connected to one side of23the diode bridge network and the load to the other side as shown below. The four diodes labelled D1to D4 are arranged in series pairs with only two diodes conducting current during each half cycle.During the positive half cycle of the supply, diodes D1 and D2 conduct in series while diodes D3 andD4 are reverse biased and the current ows through the load as shown below.The Positive Half-cycle Figure 3.14:positive half cycleThe Negative Half-cycleAs the current owing through the load is unidirectional, so the voltage developed across the loadis also unidirectional the same as for the previous two diode full-wave rectier, therefore the averageDC voltage across the load is 0.637Vmax. During the negative half cycle of the supply, diodes D3 and D4 conduct in series, but diodes D1and D2 switch OFF as they are now reverse biased. The current owing through the load is the samedirection as before.24Typical Bridge RectierHowever in reality, during each half cycle the current ows through two diodes instead of justone so the amplitude of the output voltage is two voltage drops ( 2 x 0.7 = 1.4V ) less than the inputVMAX amplitude. The ripple frequency is now twice the supply frequency (e.g. 100Hz for a 50Hzsupply or 120Hz for a 60Hz supply.) Although we can use four individual power diodes to make afull wave bridge rectier, pre-made bridge rectier components are available off-the-shelf in a rangeof different voltage and current sizes that can be soldered directly into a PCB circuit board or beconnected by spade connectors. The image to the right shows a typical single phase bridge rectierwith one corner cut off. This cut-off corner indicates that the terminal nearest to the corner is thepositive or +ve output terminal or lead with the opposite (diagonal) lead being the negative or -veoutput lead. The other two connecting leads are for the input alternating voltage from a transformersecondary winding. Figure 3.15:output waveform of full wave bridge rectieriii. FilterRC=Vdc/Idc=8.08/(500mA)Let ripple factor=0.12VC=2900/(RI x RF)=2900/(16.54 x 0.12)=961uFSo select the standard capacitor of 1000uF25For the capacitorVrating greater than VmVm=12.72VTherefore Vrating of the capacitor Vcap=25VSo, select lter capacitor of the rating 25V, 1000uF. Figure 3.16:electrolytic capacitorAn electrolytic capacitor is a sort of capacitor that utilizes an electrolyte to obtain greater capac-itance than the other type of capacitors. An electrolyte is a gel or uid in which concentration ofions is very high. Electrolytic capacitor is a general term used for three different capacitor familymembers:1. Aluminium electrolytic capacitors2. Tantalum electrolytic capacitors3. Niobium electrolytic capacitors26Figure 3.17:aluminum electrolytic capacitor indicating positive and negative terminalsAlmost all the electrolytic capacitors are polarized which means the voltage of anode must be al-ways higher than the cathode. The ability of large capacitance makes them highly useful for sendinglow-frequency signals. They are extensively used for noise ltering or decoupling in power supplies.The advantage of large capacitance comes with few drawbacks as well. Drawbacks include leakagecurrents, equivalent series resistance and a limited lifetime. Electrolytes are made up of aluminum ortantalum and few other metals.A special type of electrolytic capacitors with capacitances of hundreds and thousands of farads areknown as super capacitors. They are also known as double-layer electrolytic capacitors.Characteristics:Capacitance Drift:-The electrical characteristics highly depend on the type of electrolyte used and the anode. The ca-pacitance of electrolytic capacitors has large tolerances 20 Applications:1. Used to reduce voltage uctuations in various ltering devices.2. Used in output and input smoothing to lter when DC signal is weak with AC component.3. They are extensively used for noise ltering or decoupling in power supplies.They are used for coupling signals between amplier stages and also to store energy in ash lampsiv. Voltage Regulator A voltage regulator is an electronic circuit that provides a stable dc voltageindependent of the load current, temperature and ac line voltage variations. It may use an electrome-chanical mechanism, or electronic components. Depending on the design, it may be used to regulateone or more AC or DC voltages. Voltage sources in a circuit may have uctuations resulting in notgiving xed voltage outputs. Voltage regulator IC maintains the output voltage at a constant value.7805 IC, a voltage regulator integrated circuit (IC) is a member of 78xx series of xed linear voltageregulator ICs used to maintain such uctuations. The xx in 78xx indicates the xed output voltage itprovides. 7805 IC provides +5 volts regulated power supply with provisions to add heat sink as well.Lets look into some of the basic ratings to get an overview.7812 IC Rating Input voltage range 7V- 35V Current rating Ic = 1A Output voltage range VMax =12.2V, VMin =11.8V27Figure 3.18:pinout diagram of LM7812Pin Description of 7812 ICThe difference between the input and output voltage appears as heat. The greater the difference PIN NO. PIN Function DESCRIPTION1 INPUT Input voltage(14V-37V) In this pin of theIC positive unreg-ulated voltage isgiven in regula-tion. 2 GROUND Ground (0V) In this pin wherethe ground isgiven. This pinis neutral forequally the inputand output. 3 OUTPUT Regulated output;12V (11.8V-12.2V) The output of theregulated 12Vvolt is taken outat this pin of theIC regulator. Table 3.10:Pin Details of 7812 IC28between the input and output voltage, the more heat is generated. If too much heat is generated,through high input voltage, the regulator can overheat. If the regulator does not have a heat sink todissipate this heat, it can be destroyed and malfunction. Hence, it is advisable to limit the voltage toa maximum of 2-3 volts higher than the output voltage. So the two options are, design your circuitso that the input voltage going into the regulator is limited to 2-3 volts above the output regulatedvoltage or place an appropriate heat sink that can efciently dissipate heat.3.3.12 RelayThe Single Pole Double Throw SPDT relay is quite useful in certain applications because of its inter-nal conguration. It has one common terminal and 2 contacts in 2 different congurations: one canbe Normally Closed and the other one is opened or it can be Normally Open and the other one closed.So basically you can see the SPDT relay as a way of switching between 2 circuits: when there is novoltage applied to the coil one circuit receives current, the other one doesnt and when the coil getsenergized the opposite is happening. Figure 3.19:relayTerminal Pins A Single Pole Double Throw Relay comes with ve terminal points.The terminals are COIL, COIL, COM, and NO, and NC.Terminal Descriptions1 COILThis is one end of the coil.2 COILThis is the other end of the coil. These are the terminals where you apply voltage to in order to givepower to the coils (which then will close the switch). Polarity does not matter. One side gets positivevoltage and the other side gets negative voltage. Polarity only matters if a diode is used.3 NOThis is Normally Open switch. This is the terminal where you connect the device that you want therelay to power when the relay is powered, meaning when the COIL receives sufcient voltage. Thedevice connected to NO will be off when the relay has no power and will turn on when the relayreceives power.29Figure 3.20:Schematic of Relay Figure 3.21:Actual view of Relay4 NCThis is the Normally Closed Switch. This is the terminal where you connect the device that you wantpowered when the relay receives no power. The device connected to NC will be on when the relayhas no power and will turn off when the relay receives power.5 COMThis is the common of the relay. If the relay is powered and the switch is closed, COM and NO havecontinuity. If the relay isn’t powered and the switch is open, COM and NC have continuity. This isthe terminal of the relay where you connect the rst part of your circuit to.Features1. MI-1 pole series relay cover switching capacity 10A.2. Slim type and small occupying area can offer high density P. C. Board technique.3. Insulation distance of 8mm min. is designed. By using insulation that meets JIS insulation classE, a dielectric strength of 5000V min. and surge resistances of 1000V min. are possible.4. Employment of suitable plastic materials to be applied to high temperature and various chemical30solutions.5. Complete protective construction from dust and soldering ux.3.3.12 LED Figure 3.22:LEDFeatures1. Popular T-1 3/4 colorless 5mm package.2. High luminous power.3. Typical chromaticity coordinates x=0.30, y=0.29 according to CIE1931.4. Bulk, available taped on reel. ESD-withstand voltage: up to 4KV5. The product itself will remain within RoHS compliant version.Descriptions1 The series is designed for application required high luminous intensity.2 The phosphor lled in the reector converts the blue emission of InGaN chip to ideal white.Applications1 Outdoor Displays2 Optical Indicators3 Backlighting4 Marker Lights3.4 Software Design3.4.1 Modern tools used ALTIUM for PCB making OrCAD- For circuit diagram Visual Basic Commchk for RS232 cable testing31Gold wave software for DTMF voice recordingAltium: Figure 3.23:Screenshot of Altium softwareAltium Limited is an Australian owned public software company that provides PC-based electron-ics design software for engineers. Founded in Tasmania, Australia 1985, Altium now has regionalheadquarters in Australia, China, United States, Europe, and Japan, with resellers in all other ma-jor markets. The company was known as “Protel” until 2001. Schematic capture module provideselectronic circuit editing functionality, including:Component library management Schematic document editing (component placement, connectivity editing and design rules def-inition) Integration with several component distributors allows search for components and access tomanufacturer’s data. SPICE mixed-signal circuit simulation Pre-layout signal integrity analysis Net list exportOrCAD:OrCAD is a proprietary software tool suite used primarily for electronic design automation (EDA).The software is used mainly by electronic design engineers and electronic technicians to create elec-tronic schematics and electronic prints for manufacturing printed circuit boards.The name OrCAD is a portmanteau, reecting the company and its software’s origins: Oregon +CAD. OrCAD PCB Designer is a printed circuit board designer application, and part of the OrCADcircuit design suite. PCB Designer includes various automation features for PCB design, board-level32Figure 3.24:Screenshot of OrCAD softwareanalysis and design rule checks (DRC). The PCB design may be accomplished by manually tracing PCB tracks, or using the Auto-Routerprovided. Such designs may include curved PCB tracks, geometric shapes, and ground planes.PCB Designer integrates with OrCAD Capture, using the component information system (CIS) tostore information about a certain circuit symbol and its matching PCB footprint.Visual Basic Figure 3.25:Screenshot of VB softwareVisual Basic is a third-generation event-driven programming language and integrated develop-ment environment (IDE) from Microsoft for its COM programming model rst released in 1991.Microsoft intended Visual Basic to be relatively easy to learn and use. Visual Basic was derivedfrom BASIC and enables the rapid application development (RAD) of graphical user interface (GUI)applications, access to databases using Data Access Objects, Remote Data Objects, or ActiveX Data33Objects, and creation of ActiveX controls and objects.A programmer can create an application using the components provided by the Visual Basic pro-gram itself. Over time the community of programmers has developed new third party components,keeping this programming language to modern standards. Programs written in Visual Basic can alsouse the Windows API, which requires external function declarations.Furthermore, new third party functions (which are open source) using part VB6 source code andpart embedded machine code, make the Visual Basic 6.0 applications faster than those designed inC++.The nal release was version 6 in 1998 (now known simply as Visual Basic).Though Visual Basic 6.0 IDE is unsupported as of April 8, 2008, the Visual Basic team is committedto It Just Works compatibility for Visual Basic 6.0 applications on Windows Vista, Windows Server2008including R2, Windows 7, and Windows 8 In 2014 there are hundreds of thousands of developerswho still prefer Visual Basic 6.0 over Visual Basic .NET. Moreover, in recent years some developerslobbied aggressively for a new version of Visual Basic 6.0. A dialect of Visual Basic, Visual Basic forApplications (VBA), is used as a macro or scripting language within several Microsoft applications,including Microsoft Ofce.34Introduction of AT COMMANDSAT commands are a set of commands that has been standardized to communicate with terminalequipments such as modem, mobile phone as well as control them. Most GSM modems supports ATcommands. The command set is quiet elaborate. However, only a small part of it is related to SMSoperations. The most frequently used commands are:AT+CMGS – To send a short message AT+CMGR To read a short message from the GSM module AT+CMGL To list SMS short messages stored in the GSM module AT+CMGD To delete a short message from the GSM module AT+CMGF To convert the message into machine instruction format AT+CPMS To select the SMS memory AT+CNMI To remind mode set up when receive a new message.As the low level function interface to the GSM modem, these commands play a fundamental role inthe software developing of the gateway program.35Here, XXXX is the 4 digit passwordSr.No Action Needed SMS Command Details1 To Add Reg-istered MobileNumber *XXXXA ( 10-DigitMobile no.)hash 2 To Delete Reg-isterd MobileNumber *XXXXD (10-DigitMobile No.)hash 3 To Get RegisterdMobile NumberList *XXXXLSThash4 To Start Motor *XXXXONhash5 To Stop Motor *XXXXOFFhash6 To Set MotorCurrent *XXXXSPChash7 To Change Pass-word *XXXXCPWD(4 DigitNew Password)hash 8 To Load FactorySetting *XXXXLFShash9 To Get MotorStatus on Site *XXXXSTShash10 To Check Param-eter Settings *XXXXPSEThash11 To Check Mea-surement Values *XXXXREADhash12 To Stop Outgo-ing SMS FromStarter Unit *XXXXDSMShash13 To Start Outgo-ing SMS FromStarter Unit *XXXXESMShash14 To Start PasswordProtection (SMSand CALL) *XXXXEPWDhash15 To Stop PasswordProtection (SMSand CALL) *XXXXDPWDhash16 To Reset AllFaults Occurred *XXXXRSTFhash17 To Set Power OnTime *XXXXPOT(3 DigitValue)hash 18 To Set AutoSwitch Time *XXXXAUT(3 DigitValue)hash 19 To Set Set StartTo Delta ChangeOver Time *XXXXSDT(2 DigitValue)hash 20 To Set UnderVoltage *XXXXUV(3 DigitValue)hash 21 To Set Over Volt-age *XXXXOV(3 DigitValue)hash 22 To Set UnbalanceVoltage *XXXXUNBAL(2Digit Value)hash 36Here, XXXX is the 4 digit password23 To Set OL/DryReset Time *XXXXODR(4 DigitHHMM)hash 24 To Set Dry RunTrip Percentage *XXXXDRY(2 DigitValue)hash 25 To Set Over LoadCurrent Trip Per-centage *XXXXOLC(3 DigitValue)hash 26 To Set MotorOFF Time *XXXXSTMR(4 DigitHHMM)hash 27 To Enable MotorOFF Timer *XXXXETMRhash28 To Disable MotorOFF Timer *XXXXDTMRhash29 To Enable DryRun Protection *XXXXEDRYhash30 To Disable DryRun Protection *XXXXDDRYhash31 To Enable AutoMode Operation *XXXXEAUTOhash32 To Disable AutoMode Operation *XXXXDAUTOhash33 To Enable OverLoad/CurrentProtection *XXXXEOLhash34 To Disable OverLoad/CurrentProtection *XXXXDOLhash35 Help Menu *XXXXHELPhashTable 3.11:GSM Commands37Commchk:Figure 3.26:Screenshot of CommchkCommchk is used to analyze information on a serial line by intercepting the information and al-lowing you to view the captured information in either a HEX format or in an ASCII format. Theinformation captured may also be saved in les stored on disk. Commchk performs this functionby routing any information read from com1 to com2 and any information read from com2 to com1,while capturing the information for display and or saving to a le. Commchk will split the screen into2 windows, an upper window and a lower window. the upper window will display the informationcaptured from com1 and sent to com2. The lower window will display the information captured fromcom2 and sent to com1. This program was developed to allow analyzing information being sendfrom a host computer to a slave computer to determine the source of errors that were getting into thesystem. Alternatively, Commchk can be used to allow a computer that does not have a modem toaccess the modem of a second computer.Gold Wave SoftwareGoldWave is a commercial digital audio editing software product developed by GoldWave Inc, rstreleased to the public in April 1993.FeaturesGold Wave has an array of features bundled which dene the program. They include:Real-time graphic visuals, such as bar, waveform, spectrogram, spectrum, and VU meter. Basic and advanced effects and lters such as noise reduction, compressor/expander, volumeshaping, volume matcher, pitch, reverb, re-sampling, and parametric EQ. Effect previewing Saving and restoring effect presets38Figure 3.27:Gold wave software used for voice recording DirectX Audio plug-in support Batch processing and conversion support lets you convert a set of les to a different format andapply effects. Multiple undo levels Edit multiple les at once Support for large le editing Storage option available to use RAM3.4.2 Algorithms1. Start2. Initialize timer, interrupt, counter, GSM modem3. Read ADC and calculate voltage and current4. If starter is in auto mode give the call to the registered no5. Wait for command6. If*xxxxa(10-digit mobile no.)hash then add registered mobile number, if not go to next.7. If*xxxxd(10-digit mobile no.)hash then delete registered mobile number, if not go to next.8. If *xxxxlsthash then to get registered mobile number list, if not go to next.9. If *xxxxonhash then start motor, if not go to next.10. If*xxxxoffhash then stop motor, if not go to next.11. If *xxxxspchash then set motor current If not go to next12. Check all command given in the Following table13. Stop391 To Select IVRS Language 1 *XXXXLAN1hash *1234LAN1hash2 To Select IVRS Language 2 *XXXXLAN2hash *1234LAN2hash3 To Select IVRS Language 3 *XXXXLAN3hash *1234LAN3hash4 To Select IVRS Language 4 *XXXXLAN4hash *1234LAN4hash5 To Add Reg-istered MobileNumber *XXXXA(10-Digit MobileNo.)hash *1234Amob no.hash No Number6 To Delete Reg-istered MobileNumber *XXXXD(10-Digit MobileNo.)hash *1234Dmob no.hash -7 To Get Regis-tered MobileNumber List *XXXXLSThash *1234LSThash -8 To Start Motor *XXXXONhash *1234ONhash -9 To Stop Motor *XXXXOFFhash *1234OFFhash -10 To Set MotorCurrent *XXXXSPChash *1234SPChash -11 To Change Pass-word *XXXXCPWD(4Digit PWD)hash *1234CPWD1234hash 123412 To Load FactorySetting *XXXXLFShash *1234LFShash -13 To Get MotorStatus on Site *XXXXSTShash *1234STShash -14 To Check Param-eter Settings *XXXXPSEThash *1234PSEThash -15 To Check Mea-surement Values *XXXXREADhash *1234READhash -Table 3.12:IVRS Commands3.4.3 Flowchart40Figure 3.28:Main Unit Figure 3.29:User Setting41Figure 3.30:parameter Setting Figure 3.31:Main Form423.5 PCB Design and LayoutPrinted circuit boards may be covered in two topics; technology and design. Printed circuit boards arecalled PCB in short. Printed circuit consists of conductive circuit pattern applied to one or both sidesof an insulation base, depending upon that ,it is called single side PCB or double sided PCB(SSB andDSB). Conductor materials like silver, brass, aluminum and copper are most widely used. The thickness of Figure 3.32:Process ow for PCB Designingthe conducting material depends upon the current carrying capacity of circuit. Thus a thicker copperlayer will have more current carrying capacity.433.5.1 Introduction to PCB:The printed circuit board usually serves three distinct functions:1) It provides mechanical support for the components mounted on it.2) It provides necessary electrical interconnections.3) It acts as a heat sink that is it provides a conduction path leading to removal of most of the heatgenerated in the circuit.3.5.2 Manufacturing process of printed circuit board Figure 3.33:Manufacturing Process of Printed Circuit BoardThe conductor pattern which is on the master lm is transferred on copper clad laminate by twomethods:1) Photo resists printing.2) Screen printing.1) Photo resists printingPhotopolymer resist is a light sensitive organic material like KPR (Kodak Photo Resist) which isapplied to the board as thin lm. The photo resist when exposed to ultraviolet light hardens orpolymerizes. Once it is polymerized, it becomes insoluble to certain chemical solvents known asdevelopers.The developer dissolves the portion which is masked or which is not exposed to light. Thus the pat-tern that is to be drawn on PCB is derived from the artwork which is photographic process. This istransferred to a master lm on 1:1 scale. This can be reduced to any small size thus miniaturizationis possible. The pattern is transferred to a mask. This mask is kept on PCB. The whole process isknown as Image Transfer.The unpolymerized or masked portion is washed away in developer leaving wanted copper patternon board KPR or photo resist is then removed.Requirements of photo resists1) It should have good resolution and light sensitivity.2) It should be resistant to developers which are used to remove unwanted copper.3) It should have possibility to strip after unwanted copper is removed.4) Its cost must be less.44Photo resist is normally applied by:1) Flow coating OR2) Roller coating OR3) Dip coating OR4) SprayingScreen printing Figure 3.34:Screen printingThis technique is similar to the one used in printing industry. The copper foil is covered withprinting ink where the conducting paths are going to be. The screen which is used for pattern isof either stainless steel or polymer mesh which is dimensionally accurate and ne mesh. The openmeshes of screen correspond to the pattern. PCB is placed under the screen. Printing ink is placed atone end of the screen, and by means of a rubber squeegee it is pushed through open meshes. Printedcircuit board is then removed for drying. After drying board is washed in ferric chloride which actsas etchant. Etching is chemical process by which unwanted copper is removed. The portion whichis covered by ink is not removed, that is the pattern remains intact. Later ink stripping is done withtrichloroethylene.Protection of copper tracksCopper when exposed to atmosphere for a long time gets tarnished and problems arise at the time ofsoldering.The tracks can be protected by applying lacquer or varnish depending upon the thickness of the track.Copper is also protected by plating. There are three methods of plating.1) Immersion plating2) Electro less plating3) ElectroplatingImmersion plating utilizes tin and its alloys and gold. It is done by chemical replacement fromcoating material salt solution. This method is simple and less costly.In electro less copper coating electric current is not used. Instead, a chemical reducing agent is usedwhich supplies electrons for reaction in which copper is reduced from its ionic state.In electroplating, a DC current is passed between two electrodes, and a thin coating is deposited oncathode when immersed in electrolyte.Etching45Removal of unwanted copper, to give nal copper pattern is known as etching. Solutions which areused in etching are known as etchants.1) Ferric chloride2) Cupric chloride3) Chromic acid4) Alkaline ammoniaOut of these chemicals, ferric chloride is widely used because it has short etching time and it canbe stored for a longer time. Rinsing follows etching.Solders and soldering techniquesSolders are special alloys which are used to get either a mechanically strong joint or electric joint oflow contact resistance. Solders have low melting points compared to metals to be joined. Thereforewhen solder is heated, molten solder wets the metal, spreads and joints. Any contamination on thesurface of the metal to be joined acts as a paired and hampers the action of wetting.Solders are divided into two groups, soft and hard. Soft solders have lower melting point and lowertensile strength. Soft solders are largely tin lead alloys and silver based compositions. Fluxes areauxiliary materials used while soldering is done.1) They dissolve and remove oxides and contaminants from surface of metals to be soldered.2) They protect the metal surface and molten solder from oxidation.3) They reduce the surface tension of molten solder.4) They improve the ability of solder to wet the metal.1. Active or acid uxes: they are prepared on the basis of active substances, such as hydrochlo-ric acid, chlorides and uorides of metals, etc. these uxes intensively dissolve oxide lms on themetal surface and thus make for better adhesion of the solder to the base metal, the residue must bethoroughly removed after soldering Active uxes are not used in soldering the circuit wires of radiodevices.2. Acid free uxes: these are rosin and rosin base material with the addition of inaction substancessuch as alcohol and glycerin. Activated uxes: these include rosin base uxes containing activatingagents in small quantities, such as hydrochlorides and phosphates of aniline, salicylic acid and hy-drochlorides of diethyl amine. A high activity of some of these uxes makes the preliminary removalof oxides after degreasing unnecessary. Figure 3.35:Bottom layer of power supply46Figure 3.36:Relay Board Layout47Figure 3.37:Bottom layer of main circuit48Figure 3.38:PCB Layout of main circuit493.6 Noise immunity of system and environment related aspectsNoise lter Figure 3.39:Typical EMI/RFI NoiseNoise lters add noise to the active layer or to the selection. Noise is dened as a high-frequency electrical distortion of the voltage waveform. It is comprised of unwanted and inter-fering voltages and currents generated by motors, ofce equipment, industrial equipment, etc.It is commonly referred to as conducted (EMI/RFI). Noise can be further broken down intothree types: Line to Neutral, Line to Ground, and Neutral to Ground. Line to Neutral noise iscalled normal mode, and Line to Ground/Neutral to Ground is called common mode. Figure 3.40:Typical Noise Paths Filter capacitorCapacitors are reactive elements, which make them suitable for use in analog electronic lters.The reason for this is that the impedance of a capacitor is a function of frequency, as explainedin the article about impedance and reactance. This means that the effect of a capacitor on asignal is frequency-dependent, a property that is extensively used in lter design.Analog elec-tronic lters are used to perform a predened signal processing function. An example of sucha function is a low-pass lter (LPF), which passes through low frequencies, but blocks highfrequencies. Another example is the high-pass lter (HPF), which passes through high fre-quencies but blocks low frequencies. These are some basic lter types which can be combined50to create other more complicated lters, such as band-pass or notch lters.Electronic lters can be realized in many different ways. They can be made using analog com-ponents only, such as capacitors, inductors, resistors, transistors, and operational ampliers.They can also be realized using digital technology digital signal processing circuits that con-sist of a specialized computer or microcontroller and software appropriate for the application.Analog lters are further divided into passive and active lters. Active lters use amplifyingcircuits and components such as transistors and opamps, while passive lters use resistors, in-ductors and capacitors exclusively. The advantage of passive lters is that no power source isneeded apart from the processed signal itself, while the advantage of active lters is reducedsize and cost.The capacitance value needed to supply the power supplies output current (I) with the speciedamount ofripple current (Vrms) with full wave rectication is:C = I Where Vrms = V(p-p) for f = 60HzVrms x 4f 2C = 2.4 I I = DC Load current of power supply in milliamps VrmsA more general formula is:C I x Vdc Where Vdc = Vm – Vp-pVrmsVm 4 2Vm = max. voltage of input waveformVp-p = peak to peak ripple voltage51Chapter 4TEST PROCEDURE AND RESULTS4.1 TestingTesting is nothing but the physical checking of the all components and all possible condition to avoidproblem in the circuit functioning. Testing done with so many checking instruments as per the circuitrequirement and conditions4.1.1 Bread board testingIn bare board testing we should have to check the following points1. Continuity of the track2. Over etching or under etching if any3. Shorts if any4. VCC and GND tracks4.1.2 Trouble ShootingAfter the PCB is prepared the conductivity test is carried out. First pin-to-pin conductivity is checked.The necessary IC interconnections are also checked. The resistance value of all the resistor arechecked and then completed with the value denoted by colour-coding is done. The capacitors arealso checked to see whether they are working or short or open. The diodes are tossed for priority.The diodes are cracked for their forward resistance and reverse resistance. After carrying out all thepossible testing, the jumper wires are also tested for conductivity.4.2 Simulation Results52Figure 4.1:power supply simulation Figure 4.2:3.3V power supply simulation53Figure 4.3:Simulation of LED interfacing Figure 4.4:Output at the receiver end54Chapter 5CONCLUSION AND FUTURE SCOPE5.1 Advantages User friendly software. Less time required for testing GSM modem System is wireless best microcontroller used for high performance By using software we can test 100 modems at a time hence high speed.5.2 Applications In Industrial starter motor. In Agriculture elds. VTS Industry PDA Personal tracking Wireless POS Smart metering5.3 ConclusionThe project we have undertaken has helped us gain a better perspective on various aspects relatedto our course of study as well as practical knowledge of electronic equipments and communication.We became familiar with software analysis, designing, implementation, testing and maintenance con-cerned with our project.555.4 Future scopeHome automation security system using GSM modem with sms GSM based campus display system Electric line man safety using microcontroller with GSM module Railway track security system using GSM modem Bank security system using GSM and PIR sensor56REFERENCES1. Herman Chung- HwaRao, Di-Fa Chang and Yi-Bing Lin, iSMS: An Integration Platform forShort Message Service and IP Networks, IEEE Network, pp.48-56, March/April (2001).2. Jeff Brown, Bill Shipman and Ron vetter, SMS: The Short Message service , IEEE ComputerSociety, pp.106-111, December (2007).3. VeenaDivyak, AyushAkhouri,A Real time implementation of a GSM based Automated IrrigationControl System using drip Irrigation Methodology (Volume 4, Issue 5, May 2013).4. Books:GSM and Personal Communications Handbook-SiegmundRedl, -Matthias Weber- MalcomW. Oliphant.5. Sougata Das, Nilava Debabhuti, Rishabh Das, Sayantan Dutta, Apurba Ghosh, Embedded Systemfor Home Automation Using SMS, University of Burdwan,Golapbag (North)6. Anand Jadhav, Jayashree Bage, Prof. P.S.Badgujar, Smart Android App for Controlling SinglePhase Motor , ISSN : 2454-9150 Vol-02, Issue 12, Mar 20177. K.Anusha, T.Suresh, K.Niranjan Reddy, GSM Based Automation System for Agricultural Field,IJCSMC, Vol. 4, Issue. 1, January 2015, pg.236 24157

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